Vacuum suction pump with adjuster and you can adjust vacuum suction pressure. Suction range: 0-12000pa. Do not worry SMD components sucked up to the solder paste printed on the paste after the phenomenon was sucked back.
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I’ve recently had the opportunity to try out the Vacuum Suction Pen IC SMD SMT BGA Chip Pick-Up Tool, and I must say, it has revolutionized my workflow in a remarkable way.

The first thing that struck me was the adjustable vacuum suction pressure. This feature allows for precision when handling sensitive components, ensuring they’re not damaged during the pick-up process. The suction range of 0-12000pa provides ample control over the tool.

One concern I initially had was the possibility of SMD components getting stuck to the solder paste. However, I found that this tool is designed with such instances in mind. Any component sucked up can be easily returned to its original position without any trace left on the paste.

The tool comes as a set of two pens, which is particularly useful for collaborative work environments or assembly lines where multiple workers are involved. The easy operation makes it simple for anyone to use; just block the hole with a finger to pick up a component, and open it to release the component.

The package includes various accessories such as tubes, needles, and suckers of different sizes. This ensures that you have all the tools necessary for BGA repair tasks. The inclusion of two pens also allows for simultaneous use, increasing productivity in the workspace.

In conclusion, this Vacuum Suction Pen has proven to be an indispensable tool in my work. Its precision, ease of use, and versatility make it a valuable addition to any electronic repair kit. Whether you’re a seasoned professional or just starting out, I highly recommend giving this tool a try.

  • 110V electrical pick up tool for IC SMD SMT BGA Chip Pick-up, Vacuum suction pump for BGA repair accessories.
  • Vacuum suction pump with adjuster and you can adjust vacuum suction pressure. Suction range: 0-12000pa. Do not worry SMD components sucked up to the solder paste printed on the paste after the phenomenon was sucked back.
  • Come with two pens. Both of them can be used at the same time for two workers to share on the assemble line.
  • Easy operation. Block the hole with a finger on the pen to pick up a component, open the hole to release the component.
  • Package include: 1 x Pump Vacuum Suction Pen Placement Machine, 2 x Vacuum Suction Pen, 2 x Tube, 3 x Needles (1.6mm), 2 x Sucker (3mm,10mm)

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